Sources say TSMC is considering advanced chip packaging capacity in Japan

Taiwan Semiconductor Manufacturing Co. told Japan’s Prime Minister Fumio Kishida that the chipmaker expects to reach 60% local procurement for its first chip plant in the country by 2030. TSMC expects to hit 60% of local procurement by 2030, according to Japan's Prime Minister.

TSMC considering building advanced packaging capacity in Japan, sources say. Sources say it could potentially boost Japan's semiconductor industry. TSMC is considering building the capacity, potentially boosting the country's semiconducting industry. The chipmaker is also considering expanding its chip manufacturing operations in Japan.