MSquare Technology Leads IP and Chiplet Innovation at AI Summit in San Jose, Sept 2024

From September 10-12, 2024, MSquare Technology showcased its innovations at the AI Hardware & Edge AI Summit in San Jose, California, attended by over 1,500 participants and featuring more than 75 industry leaders as speakers. The event provided a platform for MSquare to highlight its advancements in semiconductor IP and Chiplet solutions, emphasizing its role in enhancing the AI ecosystem through practical applications and successful case studies. One of the key products presented was the IO Die ML100, a high-bandwidth memory solution that integrates Die-to-Die interconnect IP and supports the UCIe 1.1 protocol. This technology enables rapid data transfer and low-latency communication between chips, significantly improving the efficiency of AI model training and inference. The IO Die ML100 boasts a maximum bandwidth of 819.2 GB/s and adheres to the HBM3 JESD238 protocol, catering to the demanding requirements of AI applications. MSquare's diverse product portfolio includes high-speed interconnect IPs and advanced Chiplet solutions, validated across various process nodes from 5nm to 180nm. This extensive range supports over 400 process technologies at leading foundries, contributing to a robust ecosystem that drives innovation across multiple sectors, including AI, automotive, and consumer electronics. The summit also marked a significant step in MSquare's global expansion strategy, with new hubs established in San Jose, Sydney, and Tokyo. This initiative aims to enhance collaboration with industry leaders and address the challenges and opportunities presented by the evolving AI landscape, reinforcing MSquare's commitment to leading advancements in interconnect IP and Chiplet technology.