MediaTek Dimensity 9400+ enhances mobile AI and connectivity features
- The Dimensity 9400+ features four Cortex-A720 cores, three Cortex-X4 cores, and one Cortex-X925 core.
- It supports 5G download speeds of up to 7 Gbps and offers Bluetooth connectivity of up to 15 kilometers.
- This launch indicates MediaTek's commitment to improving mobile AI and connectivity technologies.
In a significant development in mobile technology, MediaTek has released its latest flagship mobile chipset, the Dimensity 9400+. This powerful chipset, introduced on April 11, 2025, is touted for its enhancements in on-device artificial intelligence and connectivity features. MediaTek, a prominent player in mobile chip manufacturing, aims to boost the performance and efficiency of high-end Android smartphones through this innovative product. The advanced architecture of the Dimensity 9400+ is built using TSMC's second-generation 3nm N3E technology, allowing for smoother user experiences and faster processing speeds. The Dimensity 9400+ retains an all-big core design, featuring four Cortex-A720 cores alongside three Cortex-X4 cores and a single Cortex-X925 core. This architecture translates to a maximum clock speed of 3.73GHz, which is a notable increase from its predecessor, the Dimensity 9400. Maintaining a competitive edge in graphics performance, the new chipset utilizes the same 12-core Immortalis-G925 GPU capable of advanced features such as upscaling and ray tracing. With the integration of a MediaTek NPU 890, the chipset supports local execution of sophisticated DeepSeek-R1 AI models, enhancing the capabilities of on-device AI applications. Additionally, the Dimensity 9400+ significantly enhances connectivity options. It boasts an impressive Bluetooth range of up to 15 kilometers, optimizing phone-to-phone connections for seamless interaction between devices. The chipset also supports 5G download speeds of up to 7 Gbps, a critical feature for high-speed data transfer in contemporary mobile applications. Moreover, when paired with the innovative TSMC architecture, this processor promises better standby battery efficiency, an essential aspect for users relying on their smartphones for prolonged periods. Smartphones incorporating the Dimensity 9400+ are expected to become available to consumers in the second quarter of 2025, suggesting a promising period for mobile technology enthusiasts. With its launch, MediaTek aims to redefine the standards for AI processing, gaming experiences, and overall connectivity in high-end mobile devices, paving the way for future advancements in the industry.