Mar 21, 2025, 10:37 PM
Mar 21, 2025, 10:37 PM

RAM Photonics Industrial launches innovative Medusa Array for AI and DC markets

Highlights
  • RAM Photonics Industrial launched the Medusa Array product family, a 2D fiber array produced with submicron precision using fully automated techniques.
  • The Medusa Array can scale beyond 1024 fiber ports with negligible insertion loss, addressing the need for cost-effective optical-to-electronic interfaces.
  • This launch positions RAM as a leader in high-volume fiber interconnects, critical for infrastructure in AI and data center expansion.
Story

In Rochester, New York, on March 21, 2025, RAM Photonics Industrial, LLC, announced a significant advancement in automated photonics manufacturing with the introduction of the Medusa Array product family. This new scalable 2D fiber array is produced with submicron precision using high-speed, fully automated techniques, which effectively eliminates the need for manual assembly and testing. The launch signifies a major milestone as it marks the introduction of the first mass-produced optical interface capable of scaling beyond 1024 fiber ports, boasting negligible insertion loss. This innovation is geared towards addressing the growing demands for high-volume, low-cost optical-to-electronic interfaces used in optical circuit switching (OCS) and co-packaged optics (CPO) in various technological applications. RAM's advanced manufacturing capabilities allow for the customization of interface geometry, collimation layers, and fiber types, all while maintaining the volume and cost efficiency standardly associated with high-yield semiconductor production. The industry is facing expansive requirements as artificial intelligence, data center infrastructure, and high-performance computing continue to evolve. The ability to mass-produce essential photonics-to-electronic connectors is becoming critical. RAM, through the Medusa Array, takes a significant step forward in meeting these industry needs by integrating submicron-precision 2D fiber arrays and semiconductor or MEMS backplanes without the use of epoxy. John Marciante, the CEO of RAM Photonics, stated the company’s pride in launching the Medusa Array, reinforcing their commitment to lead in the field of high-volume fiber interconnects. Interested parties can learn more about the product at RAM Photonics' booth #3357 during OFC 2025 in San Francisco, scheduled for April 1-3.

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