Mitsubishi Electric to Ship 200Gbps Chip for Fiber Communication
- Mitsubishi Electric Corporation will start shipping samples of a new 200Gbps chip for optical transceivers.
- The chip will support 800Gbps and 1.6Tbps fiber communication.
- Samples to be available from October 1, 2024.
Tokyo, August 19, 2024 – Mitsubishi Electric Corporation has announced the upcoming release of its new 200Gbps PIN-photodiode (PD) chip, designed to enhance next-generation optical transceivers for high-speed fiber communication. The company plans to begin shipping samples of this innovative chip on October 1, 2024, marking a significant advancement in optical reception technology. This new chip is set to support the growing demand for faster data transmission, specifically targeting 800Gbps and 1.6Tbps communication systems. The introduction of the 200Gbps PIN-PD chip follows Mitsubishi Electric's earlier launch of a mass-produced 200Gbps electro-absorption modulator laser diode (EML) in April 2024, which was aimed at optical transmission. Mitsubishi Electric's latest development is expected to play a crucial role in the evolution of fiber optic networks, facilitating higher bandwidth and improved performance for various applications. The company is positioning itself as a key player in the semiconductor market, particularly in the realm of optical communication technologies. For further inquiries, Mitsubishi Electric has provided contact details for its Semiconductor & Device Marketing Division and Public Relations Division, ensuring that interested parties can obtain more information about the new chip and its applications.