Amkor Technology Partners with U.S. Department of Commerce for Semiconductor Facility in Arizona

Amkor Technology, Inc. has announced a significant step in its operations by signing a non-binding preliminary memorandum with the U.S. Department of Commerce to secure funding under the CHIPS and Science Act. This initiative aims to establish an advanced packaging and test facility in Arizona, enhancing Amkor's role as a key manufacturing partner for leading semiconductor companies and contributing to the U.S. semiconductor manufacturing landscape. The new facility is expected to create approximately 2,000 jobs and bolster the domestic semiconductor ecosystem. Amkor's collaboration with TSMC will focus on delivering high-volume, cutting-edge technologies for semiconductor packaging and testing, catering to critical sectors such as high-performance computing, automotive, and communications. Giel Rutten, Amkor's CEO, emphasized the company's commitment to supporting the growing semiconductor community in the U.S. U.S. Secretary of Commerce Gina Raimondo highlighted the importance of advanced packaging in driving chip innovation and national security. She noted that the chips produced in Arizona will be foundational for future technologies, reinforcing the Biden-Harris Administration's efforts to enhance supply chain security and create jobs in the region. Arizona Senator Mark Kelly, a chief negotiator of the CHIPS Act, praised the announcement as a vital move to strengthen U.S.-based advanced packaging operations. He stated that the facility will not only expand Arizona's semiconductor ecosystem but also contribute to economic growth in the state, marking a critical advancement in the nation's microchip supply chain.