FIC Global expands optical transceiver business to meet evolving demands
- FIC Global Inc. announced a major expansion of its optical transceiver business to address the growing silicon photonics demand.
- The company has achieved significant market shares in various optical transceiver categories and has tripled its production capacity in response to sales growth.
- This expansion positions FIC Global at the forefront of the optical transceiver industry, emphasizing its commitment to ongoing innovation.
In Taipei on May 6, 2025, FIC Global Inc., a leader in the semiconductor packaging industry, revealed plans to expand its optical transceiver business. This strategic move aims to cater to the increasing demands stemming from advancements in silicon photonics, particularly for next-generation data centers. The emergence of AI-powered data centers has prompted the need for co-packaged optics (CPO) switches that promise ultra-fast intercommunication capabilities, enhanced energy efficiency, and reduced latency. The benchmark for data transmission speeds has grown to a remarkable 1.6 terabits per second, with expectations of doubling to 3.2 terabits in the near future. FIC Global's expansion is set to include the announcement of new manufacturing facilities later this year, reaffirming its crucial role in the ongoing optical transceiver revolution. The company has been in the optical transceiver market since 2008 and has witnessed substantial growth. In 2024, FIC Global achieved a market share of 17.5% in both 800G and 1.6T optical transceivers, alongside a 20% share in the 400G segment. This robust growth is a testament to FIC Global's commitment to innovation and process leadership within the industry. As industry demands skyrocket, FIC Global has tripled its optical module production capacity over the past two years to accommodate significant sales growth. The company collaborates closely with upstream semiconductor manufacturers and downstream optical transceiver customers, utilizing advanced techniques for packaging electronic and optical semiconductors onto printed circuit boards (PCBs). Furthermore, FIC Global is also recognized for its precision and stringent quality controls, employing cutting-edge technologies such as 3D X-ray for rigorous testing and evaluation. The integration of various manufacturing techniques, including high-tech processes like 2.5D and 3D semiconductor packaging, sets FIC Global apart in the supply chain. This comprehensive approach facilitates supply chain simplification for customers while ensuring uncompromising quality. The company’s legacy of innovation stems from its unique combination of capabilities and a strong foundation built through the merger of FIC, Ubiqconn, and 3cems. As FIC Global prepares to lead the continued transformation within optical transceiver components, the industry looks forward to the company maintaining its status as a key ecosystem player well into the future.