Ansys Honored with TSMC's 2024 Award for AI and HPC Design Excellence
- Ansys won four TSMC 2024 OIP Partner of the Year awards for its contributions to multiphysics analysis solutions.
- The company's collaborations focused on enhancing power integrity and thermal management for advanced silicon processes.
- This recognition emphasizes the significance of partnerships in advancing semiconductor technology and improving design efficiency.
On October 25, 2024, Ansys was honored at TSMC's annual OIP Partner of the Year awards in the United States, recognizing its significant contributions to design enablement for advanced silicon systems, particularly in multiphysics analysis. Ansys was awarded for its joint development of solutions that enhance power integrity, reliability, and thermal management in support of TSMC's advanced silicon processes, particularly for high-performance computing and artificial intelligence applications. The collaboration has focused on integrating design solutions that include thermal analysis and managing complex coupling challenges. Additionally, Ansys contributed to developing AI-assisted processes that automate circuit designs and enhance product performance. This recognition underlines the importance of partnerships in driving innovation and improving the efficiency of semiconductor designs, which are critical for next-generation technologies.